Tabletop Flip Chip Bonder CB-200 Athlete FA Model
Space-saving semi-auto FC bonder compatible with 100[V] power supply.
The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.
- Company：日精 本社
- Price：10 million yen-50 million yen
